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This chart represents an overview of Triangle
Circuit's current standard manufacturing process. For a detailed
listing of process capabilities and tolerances or to inquire
about individual requirements, please contact a customer service
representative at
412-828-5322.
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Laminates
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Board Thickness
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Layer Count
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RoHS Compliant
FR-4 IPC-4101/21/24
UL 796 DSR 94-VO
Rogers-4350 Series
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.020" - .125"
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1 - 12 Layer
|
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Minimum Drilled Hole Size
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Soldermask Type
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.010" (.008" finished)
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Liquid Photoimagable
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IPC-SM-840 class 2 and 3
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Minimum Lines/Spaces
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SMT Pitch
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BGA
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.004" - .004"
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.015"
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YES
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Surface Finishes
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Final Fabrication
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Controlled Impedance
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SMOBC, HASL
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Routed palletizing
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YES
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ENIG
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Scored palletizing
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Immersion White Tin
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OPS (Entek Plus)
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Testing Capabilities
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Reports Available by request
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Full netlist electrical testing
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SEM/EDAX
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X-ray flourescense
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Flying probe
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Microsection
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Capacitance plating
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 Ionic
Contamination to PC |
Solderability to
J-Std-003
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