Surface Mount Technology

State-of-the-Art Surface Mount Technology

With multiple surface mount lines, featuring leading edge pick and place technology, we have the flexibility and capacity to build a variety of assemblies. Because of our capability to handle both leaded and lead-free applications for RoHS compliance, we offer our customers the highest standards of quality and reliability.

We're dedicated to the utilization of best practices of lean manufacturing in all of our operations, including surface mount assembly. With investments in equipment such as additional feeders for offline setup, we are consistently improving our process yields and reducing downtime by significantly improving line changeovers and setup.

Surface Mount Equipment and Capabilities

  • Capable of placing 0201 SM devices, 2ml x 1ml
  • Fine pitch down to .012"
  • Micro-BGA assembly
  • AOI (Automated Optical Inspection) of SMT assemblies
  • Laser vision, solder-paste height measurement system for screen printing
  • X-ray inspection

More About SMT

Surface-mount technology (SMT) is a method for constructing electronic circuits in which the components are mounted directly onto the surface of printed circuit boards. An electronic device so made is called a surface-mount device (SMD). In the industry it has largely replaced the through-hole technology construction method of fitting components with wire leads into holes in the circuit board.

An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix of solder balls (BGAs), or terminations on the body of the component.